-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
A Potpourri of Design PD Classes
May 14, 2024 | Kelly Dack, I-Connect007Estimated reading time: 2 minutes
What is invention without innovation? What is innovation without capability? What is capability without standards and guidelines? What are standards and guidelines without the design and manufacturing stakeholders who produce them?
Folks say that invention involves the creation of things entirely new, while innovation is the process of improving the creations or finding new ways to use them. This observation holds true in all realms of PCB design. However, PCB designers, seated at PCB design workstations with very powerful CAD tools at hand, often misunderstand the concept of invention. Like a new musician making a lead error in a blues riff will refer to off-color notes as “jazz,” many new PCB designers not checking in with supplier capabilities will consider their work an “invention.”
A mistake is a mistake. DFM is a step in the innovation process, which is a necessary part of design. If new materials or processes do not exist, applying the concept of invention involves long timelines and astronomical financial backing, which must occur in order to reach the goals of a new product concept.
On Sunday, April 7, I attended a “design for” Professional Development session taught by Dale Lee. Presented as a two-part morning and afternoon class, Dale covered some very important DFs: design for manufacture (DFM), design for reliability (DFR), and design for assembly (DFA), referred to holistically as DFX (design for excellence). Lee gave many examples that stressed the importance of following industry standards and guidelines in the design of printed boards and assemblies. He stressed the importance of becoming familiar with common materials, machinery, and processes the PCB industry uses in order to “design for” measured success needed by the industry in order to provide measurable quality, performance, and reliability.
Later that morning, I bounced over to the “Ask the Flexperts” PD sessions featuring Mark Finstad and Nick Koop from TTM. Both innovators in their own rights, this Flexpert tag team was able to cover all aspects of flex and rigid-flex design principles to not only confirm industry-proven design methodology but follow up with tangible, expert, manufacturing stakeholder responses from TTM to illustrate what designers can do to improve their future flex designs. The two generously provided all attendees with a tote ring of flex circuit reference material, which can serve as a tactile guide in determining how flex structures behave mechanically.
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/31/2024 | Marcy LaRont, PCB007 MagazineThis week, our columnists enjoy particular attention with Barry Olney, Mehul Dave, and Happy Holden all providing valuable insight on materials, the critical importance of the front-end engineering process once a PCB design is received, and an overview and observations around IPC APEX EXPO technical sessions.
Bell Awarded Funding for Phase 1B of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
05/30/2024 | BellBell Textron Inc., a Textron Inc. company, has been down-selected for Phase 1B of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program.
Cambridge GaN Devices Signs MoU with ITRI Covering GaN-based Power Supply Development
05/30/2024 | BUSINESS WIRECambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company, dedicating to develop energy-efficient GaN-based power devices that make greener electronics possible, has signed a Memorandum of Understanding with Industrial Technology Research Institute (ITRI) of Taiwan to solidify a partnership in developing high performance GaN solutions for USB-PD adaptors.
Connect the Dots: Designing for Reality—The Physical Manufacturing Phases
05/30/2024 | Matt Stevenson -- Column: Connect the DotsDesigning for reality is focused on the art and science of PCB design and production. If you’re trying to make a PCB that stands out for being reliable, easy to manufacture, and meets all design goals, then you’re in the perfect spot. We’re here to break down the PCB manufacturing process while sharing essential tips for smooth design and production.
Elementary, Mr. Watson: Pushing Design Boundaries
05/29/2024 | John Watson -- Column: Elementary, Mr. WatsonOverconstraint: What a concept. Our first thoughts would be: What are we hurting by overconstraining a design? Isn't it better to be safe than sorry? What is meant by overconstraint? It means to apply excessive constraints. In engineering and mathematics, it's used when there are too many simultaneous equations to result in an exact solution. For example, fitting a line to many points is overconstrained because a line cannot be drawn simultaneously through all of the points. In PCB design, overconstraints always occur, including dimensional, electrical, manufacturing, and timing constraints. The list goes on.